Our state-of-the-art facility uses the latest SMT and Through Hole Equipment to manufacture quality

The maximum size of boards for SMD mounting in our production is 610 x 1220 mm.Repair of microcircuits using optical positioning for dismantling various types of SMD components (BGA, CSP, QFP, SOJ, etc.), as well as large components and microcircuits with a small lead pitch.Production of electronic modules and blocks of special equipment class (class 3 according to the IPC-A-610D standard) of any complexity.Production of completely finished products, including special-purpose products with particularly stringent quality requirements, using automatic assembly and manual soldering.